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Mechanical stresses and deformations in a resistive heating circuit device

This multiphysics project simulates the electrical heat generation, the heat transfer, and the mechanical stresses and deformations of a heating circuit device.

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Software Used


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COMSOL Multiphysics is a finite element analysis, solver and simulation software package for various physics and engineering applications, especially coupled phenomena, or multiphysics.

For more details see Comsol .

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